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 2SK3645-01MR
FUJI POWER MOSFET
200304
Super FAP-G Series
Features
High speed switching Low on-resistance No secondary breadown Low driving power Avalanche-proof
N-CHANNEL SILICON POWER MOSFET
Outline Drawings (mm)
TO-220F
Applications
Switching regulators UPS (Uninterruptible Power Supply) DC-DC converters
Maximum ratings and characteristicAbsolute maximum ratings
(Tc=25C unless otherwise specified)
Item Drain-source voltage Continuous drain current Pulsed drain current Gate-source voltage Non-repetitive Avalanche current Maximum Avalanche Energy Maximum Drain-Source dV/dt Peak Diode Recovery dV/dt Max. power dissipation Operating and storage temperature range Isolation voltage Symbol VDS VDSX *5 ID ID(puls] VGS IAS *2 EAS *1 dVDS/dt *4 dV/dt *3 PD Ta=25C Tc=25C Tch Tstg VISO Ratings 100 70 41 164 30 41 204.7 20 5 2.16 53 +150 -55 to +150 2 Unit V V A A V A mJ kV/s kV/s W C C kVrms
Equivalent circuit schematic
Drain(D)
Gate(G) Source(S)
*6
*1 L=146H, Vcc=48V,Tch=25C, See to Avalanche Energy Graph *3 IF< -ID, -di/dt=50A/s, Vcc < BVDSS, Tch < 150C *4 VDS < 100V = = = = Symbol V(BR)DSS VGS(th) IDSS IGSS RDS(on) gfs Ciss Coss Crss td(on) tr td(off) tf QG QGS QGD IAV VSD trr Qrr
*2 Tch <150C = *5 VGS=-30V *6 t=60sec f=60Hz
Electrical characteristics (Tc =25C unless otherwise specified)
Item Drain-source breakdown voltaget Gate threshold voltage Zero gate voltage drain current Gate-source leakage current Drain-source on-state resistance Forward transcondutance Input capacitance Output capacitance Reverse transfer capacitance Turn-on time ton Turn-off time toff Total Gate Charge Gate-Source Charge Gate-Drain Charge Avalanche capability Diode forward on-voltage Reverse recovery time Reverse recovery charge Test Conditions ID= 250A VGS=0V ID= 250A VDS=VGS VDS=100V VGS=0V VDS=80V VGS=0V VGS=30V VDS=0V ID=15A VGS=10V ID=15A VDS=25V VDS=75V VGS=0V f=1MHz VCC=48V ID=15A VGS=10V RGS=10 VCC=50V ID=30A VGS=10V L=146H Tch=25C IF=30A VGS=0V Tch=25C IF=30A VGS=0V -di/dt=100A/s Tch=25C Tch=25C Tch=125C 10 34 18 1110 280 22 16 23 31 16 32 13 9 1.10 0.1 0.38
Min.
100 3.0
Typ.
Max.
5.0 25 250 100 44 1665 420 33 24 35 47 24 48 20 14 1.65
Units
V V A nA m S pF
9
ns
nC
41
A V s C
Thermalcharacteristics
Item Thermal resistance Symbol Rth(ch-c) Rth(ch-a) Test Conditions channel to case channel to ambient
Min.
Typ.
Max.
2.359 58.0
Units
C/W C/W
www.fujielectric.co.jp/denshi/scd
1
2SK3645-01MR
Characteristics
Allowable Power Dissipation PD=f(Tc)
FUJI POWER MOSFET
60
600
Maximum Avalanche Energy vs. starting Tch EAS=f(starting Tch):Vcc=48V
IAS=17A
50
500
40
400 IAS=25A
PD [W]
EAS [mJ]
30
300 IAS=41A 200
20
10
100
0 0 25 50 75 100 125 150
0 0 25 50 75 100 125 150
Tc [C]
starting Tch [C]
Typical Output Characteristics
ID=f(VDS):80s Pulse test,Tch=25C
120 20V 100 10V 80 10 100
Typical Transfer Characteristic
ID=f(VGS):80s Pulse test, VDS=25V,Tch=25C
ID [A]
60 8V 7.5V 20 7.0V 6.5V 6.0V VGS=5.5V 10 12
ID[A]
1 0.1 0 1 2 3 4 5 6 7 8 9 10 0 2 4 6 8
40
0
VDS [V]
VGS[V]
Typical Transconductance
gfs=f(ID):80s Pulse test, VDS=25V,Tch=25C
100 0.18
Typical Drain-Source on-state Resistance
RDS(on)=f(ID):80s Pulse test, Tch=25C
VGS= 6.5V7.0V 7.5V 8V 0.15 6.0V
RDS(on) [ ]
10
0.12 10V 0.09
gfs [S]
1
0.06 20V 0.03
0.1 0.1
0.00 1 10 100 0 20 40 60 80 100 120
ID [A]
ID [A]
2
2SK3645-01MR
FUJI POWER MOSFET
100
Drain-Source On-state Resistance RDS(on)=f(Tch):ID=15A,VGS=10V
7.0 6.5 6.0
Gate Threshold Voltage vs. Tch VGS(th)=f(Tch):VDS=VGS,ID=1mA
80
5.5 5.0 max.
RDS(on) [ m ]
VGS(th) [V]
4.5 4.0 3.5 3.0 min.
60 max.
40 typ.
2.5 2.0
20
1.5 1.0 0.5
0 -50 -25 0 25 50 75 100 125 150
0.0 -50 -25 0 25 50 75 100 125 150
Tch [C]
Tch [C]
Typical Gate Charge Characteristics
VGS=f(Qg):ID=30A, Tch=25C
10 14 12 10
0 1
Typical Capacitance C=f(VDS):VGS=0V,f=1MHz
10
Ciss
VGS [V]
8 6
Vcc= 50V
C [nF]
Coss 10
-1
4 2 Crss 0 0 10 20 30 40 50 10
-2
10
-1
10
0
10
1
10
2
Qg [nC]
VDS [V]
Typical Forward Characteristics of Reverse Diode
IF=f(VSD):80s Pulse test,Tch=25C
100 10
3
Typical Switching Characteristics vs. ID
t=f(ID):Vcc=48V, VGS=10V, RG=10
tf
10
10
2
IF [A]
td(off)
t [ns]
td(on) 10
1
1
tr
0.1 0.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
10
0
10
-1
10
0
10
1
10
2
VSD [V]
ID [A]
3
2SK3645-01MR
Maximum Avalanche Current vs Pulse width IAV=f(tAV):starting Tch=25C,Vcc=48V
FUJI POWER MOSFET
10
3
Avalanche Current I AV [A]
10
2
Single Pulse
10
1
10
0
10 -8 10
-1
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
tAV [sec]
10
1
Maximum Transient Thermal Impedance Zth(ch-c)=f(t):D=0
10
0
Zth(ch-c) [C/W]
10
-1
10
-2
10
-3
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
t [sec]
http://www.fujielectric.co.jp/denshi/scd/
4


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